Counterfeit Integrated Circuits

(Examples and counterfeiting techniques)

Entry of counterfeit components into electronics manufacturing has started over many decade ago.   The proliferation of counterfeit electronic components in the supplier chain costs the US government and its suppliers billions each year.  The problem does not stop here, recent reports show consumer and industrial businesses are losing over $250 billion each year because of counterfeit devices.

Airtech Lab’s knowledgeable team can help you to identify and detect counterfeit components from reaching your customers and maintaining your good standing and reputation in your industry.   Our state-of-the-art equipment and industry experts are able to photograph, inspect, document all anomalies (blacktopping, sanding, remarking…) of an IC package and compare it to a reference sample.  In addition to the package inspection, we can perform X-Ray, DC electrical tests (I-V Curve), SAM (Scanning Acoustic Microscopy) to look for delamination, X-Ray Fluorescence Spectroscopy to look for RoHS status and decapsulation to inspect die layout and marking against a known good reference sample.
The following are a few examples of counterfeit components:

  • Non-functional units

  • Sanding and re-marking

  • Blacktopping and re-marking

  • Device substitution

  • Die salvaging

  • Manufacturing rejects

  • Component lead re-attachment

  • Relabeling boxes

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Fraudulent/Counterfeit Electronic Parts: Avoidance, Detection, Mitigation, and Disposition Distributors AS6081

This SAE Aerospace Standard standardizes practices to:

  1. identify reliable sources to procure parts,

  2. assess and mitigate risk of distributing fraudulent/counterfeit parts,

  3. control suspect or confirmed fraudulent/counterfeit parts,

  4. and report suspect and confirmed fraudulent/counterfeit parts to other potential users and Authority Having Jurisdiction.